• Qualification:Master's degree or above
    Work Address:Chongqing/chengdu
    Salary:
    Update time:2025.08.20
    1. Work closely with IC design engineers, responsible for developing verification plans related to IC design projects, reviewing verification results, and developing appropriate verification strategies and plans;

    2. Develop a verification platform, use Verilog, System Verilog, UVM and other languages/tools, implement efficient chip functionality, perform performance verification, complete verification execution and debugging, and meet Tape Out requirements;

    3. Responsible for the verification progress and quality of IC design projects, and able to undertake specific technical tasks;

    4. Capable of collaborating with design and software engineers for FPGA platform and sample verification and debugging.

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  • Qualification:Master's degree or above
    Work Address:Chongqing/chengdu
    Salary:
    Update time:2025.08.20

    1. Complete detailed digital design based on chip system design specifications;

    2. Responsible for RTL design and optimization of digital circuits, and completing the corresponding design document output;

    3. Participate in FPGA verification work;

    4. Develop module validation strategies together with validation and collaborate with the validation department to complete validation work;

    5. Collaborate with the backend department to complete module timing optimization and area optimization.

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  • Qualification:Master's degree or above
    Work Address:Chongqing/chengdu
    Salary:
    Update time:2025.08.20

    1. Responsible for defining chip specification requirements, analyzing competitors, and gaining industry insights;

    2. Responsible for chip architecture design and IP selection, and outputting overall solution documents;

    3. Responsible for evaluating and making decisions on chip area, power consumption, performance, etc., and collaborating with design, backend, and other departments to optimize the chip's PPA;

    4. Responsible for low-power design and optimization of chips;

    5. Responsible for working with other departments to solve end-to-end technical challenges related to chips, including backend, packaging, chip testing, and system integration.

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headquarters address:4-5F, Building 10, Jintai Intelligent Industrial Park, Yubei District, Chongqing

Chengdu Branch:No. 1101, Building 2, Taihe International Financial Center, No. 619 Tianfu Third Street, Wuhou District, Chengdu City, Sichuan Province

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