重庆览山汽车电子有限公司

Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

Responsible for hardware work related to onboard chips, including:

1. Responsible for the development of FPGA boards and chip verification boards for automotive chips;

2. Responsible for the end-to-end hardware capability building and implementation of in vehicle chip solutions.

Business skill requirements:

1. Familiar with digital or analog circuit related knowledge, accumulated experience in basic modules such as power supply, clock, logic, and related design, development, and testing;

2. Familiar with common working principles and design points, including LDO, switching power supply, driver, memory, etc;

3. Those who have a deep understanding of the principles of the three major components (CPU/memory/hard disk) or relevant reliability application experience are preferred;

4. Familiar with and have used at least one schematic drawing tool.

Professional knowledge requirements:

1. Computer and integrated circuit design related majors, familiar with single board hardware design, independently completed multiple hardware module circuits, and have experience as a large-scale single board designer are preferred;

2. Familiar with the basics of digital and analog circuits, able to locate and analyze complex circuit problems, familiar with network protocols, storage protocols such as PCIe, SAS, FC/XGE, etc. are preferred;

3. Familiar with power circuit design, testing, and high-performance CPUs, DDR, and Ethernet devices are preferred; Experience in high-speed interface hardware testing or chip hardware engineering verification is preferred.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

Responsible for the driver development and verification of automotive MCU chip products, including:

1. Provide MCAL software that complies with Autosar specifications for the delivery of chip products;

2. Responsible for the underlying bridge of MCU chips, implementation and verification of underlying software modules related to ARM-M/R cores, as well as hardware board debugging, etc;

3. Responsible for the development and validation of basic bus controller drivers for automotive MCU chip products, including but not limited to ETH, I2C, SPI, UART, CAN, LIN, etc.

Business skill requirements:

1. Having a foundation in embedded development, mastery of embedded software development processes, and experience in bsp development are preferred;

2. Familiar with Autosar specifications, with MCAL related development experience preferred;

3. Familiar with common communication interfaces such as ETH, I2C, SPI, UART, CAN, LIN, etc;

4. Understand the ARM architecture, understand the ARM startup process, and prioritize ARM assembly.

Business knowledge requirements:

1. Complete the IP verification requirement decomposition during the MCU chip development verification phase, participate in the writing of verification cases and code development for each specific IP of the chip;

2. As the sub module owner in the chip product delivery process, responsible for the MCAL software that delivers the overall functional sub modules;

3. Ability to analyze problems from a system perspective (chip, hardware, software).

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Understand the application scenarios of automotive MCU products, develop end-to-end verification strategies, and implement them;

2. Responsible for SoC chip testing and underlying software functional testing, developing chip testing plans, and developing test cases (Test Cases);

3. Set up a chip testing environment; Complete chip and underlying software testing and submit testing reports;

4. Analyze problems and assist chip and software development teams in locating and solving them.

1. Majors related to electronics, computer science, electrical automation, information technology, etc;

2. Ability to analyze problems from a system perspective (chip, hardware, software);

3. Familiar with digital circuits, analog circuits, MCU and related software and hardware systems;

4. Clear thinking, smooth communication, good learning ability and teamwork skills;

5. Priority will be given to those who have the following experiences:

-Have experience in developing microcontrollers;

-Familiar with C/C++, Python, Matlab programming languages;

-Those who have a deep understanding or practical experience in functional safety.

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Qualification：Master's degree or above

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Responsible for simulating IC circuit schemes and architecture design;

2. Responsible for organizing and coordinating the internal work of the simulation team;

3. Responsible for developing specifications and conducting feasibility analysis for analog IC circuit modules, as well as designing and simulating specific circuits, and writing documents;

4. Assist layout design engineers in completing simulated IC layout design;

5. Responsible for post layout simulation and layout optimization;

6. Responsible for (or assisting testing engineers) developing testing plans and completing tests, as well as writing product testing specifications.

1. Experience in PLL, SDADC, or BUCK design is preferred;

2. Master's degree or above in microelectronics or related electronic information science;

3. Familiar with the design of Op amp, Band tap reference, OSC, and I/O modules;

4. Solid knowledge of circuit theory and IC design theory, familiar with CMOS technology;

5. CET-4 or above, with good English reading and writing skills;

6. Strong sense of responsibility, excellent communication skills, and a sense of teamwork.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Layout design of analog/mixed signal circuit modules;

2. Circuit module and chip floor plan planning;

3. Circuit module full chip DRC, LVS and other inspections.

1. Bachelor's degree or above, major in microelectronics or related fields;

2. Having knowledge of analog/digital circuits, understanding of semiconductor physics and semiconductor devices;

3. Proficient in simulation layout EDA circuit design software and familiar with basic layout design rules;

4. Experience in high-precision, high-speed mixed signal, RF and other layout design is preferred;

5. Experience in scripting is preferred;

6. Skilled in communication, down-to-earth in work, strong sense of responsibility, and possessing excellent teamwork spirit.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Responsible for static timing analysis, including special timing confirmation, and collaborating with the front-end to optimize critical timing paths of modules, solve congestion problems, and meet input conditions for back-end physical implementation;
2. Based on the comprehensive results, guide the backend to implement area division, module layout, and solve congestion problems;
3. Assist DFT engineers in inserting and verifying DFT circuits;
4. Responsible for the comprehensive and formal verification of modules;
5. Participate in power consumption analysis of modules, work together with design and backend to complete power consumption optimization and area optimization of modules;
6. Participate in timing convergence iteration and sign off standards after backend layout and routing.

1. Bachelor's degree or above, major in electronics or computer related fields;

2. Proficient in chip synthesis, timing analysis, formal verification, familiar with DFT, and backend implementation;

3. Experience in physical implementation with advanced process nodes; Priority will be given to those with experience in chip fabrication at nodes of 28nm and below;

5. Experience in large-scale SOC physical implementation is preferred;

6. Proficient in using scripts such as Tcl, Perl, Python, etc. to establish automated processes;

7. Have good teamwork spirit and communication skills.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Responsible for or involved in the development of chip DFT testing plans;

2. Responsible for DFT implementation in MCU chips, including Scan, Mbist, ATPG, Boundary Scan, etc;

3. Complete the simulation verification of DFT test vectors;

4. Collaborate with the front-end and back-end teams for chip development, complete Timing/Power IR analysis and convergence related to the chip design process;

5. Assist the ATE testing team in failure analysis after generating test vectors and tape out, including vector debugging, coverage optimization, and solving problems encountered during testing;

6. Participate in the development and improvement of the digital DFT process.

1. Bachelor's degree or above in microelectronics, electronics, computer science or related fields, with at least 2 years of work experience;

2. Familiarity with Synopsy or Mentor DFT related EDA tools is preferred;

3. Master DFT circuit knowledge related to BSCAN, SCAN, MBISTL, BIST, and master timing analysis methods;

5. Have experience in ATPG and DFT simulation verification, and have the ability to independently analyze problems;

6. Familiar with scripting languages TCL/Python/Perl/Shell, with good scripting skills preferred;

7. Familiar with ASIC development process, with experience in 28nm and below process chip casting preferred;

8. Strong learning ability and problem-solving skills;

9. Good teamwork spirit, communication skills, and a serious and responsible work attitude.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Responsible for the physical design work of module RTL to GDS, including floorplan, powerplan, place, CTS, route;

2. Responsible for module timing convergence and signoff work, including timing analysis、signoff SI analysis、fix、formal、low power verification；

3. Responsible for the physical verification of modules, including DRC, ANT, LVS, IR, EM, ESD;

4. Participate in the development, improvement, evaluation, analysis, and validation of digital backend processes.

1. Bachelor's degree or above, major in electronics or computer related fields;

2. Proficient in the backend physical design process of chips from RTL to GDSII, proficient in using mainstream EDA tools;

3. Has extensive experience in Floorplan, P&R, STA, Physical Verification, and other areas;

4. Experience in physical implementation with advanced process nodes; Priority will be given to those with experience in chip fabrication at nodes of 28nm and below;

5. Experience in large-scale SOC physical implementation is preferred;

6. Proficient in using scripts such as Tcl, Perl, Python, etc. to establish automated processes;

7. Have good teamwork spirit and communication skills.

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Qualification：Master's degree or above

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Work closely with IC design engineers, responsible for developing verification plans related to IC design projects, reviewing verification results, and developing appropriate verification strategies and plans;

2. Develop a verification platform, use Verilog, System Verilog, UVM and other languages/tools, implement efficient chip functionality, perform performance verification, complete verification execution and debugging, and meet Tape Out requirements;

3. Responsible for the verification progress and quality of IC design projects, and able to undertake specific technical tasks;

4. Capable of collaborating with design and software engineers for FPGA platform and sample verification and debugging.

1. Bachelor's degree or above in electronics, communication, computer science, semiconductor physics or microelectronics;

2. Having a solid foundation in IC verification, familiar with the environment and process of IC design verification, proficient in related verification tools such as VCS/NC Sim, and proficient in one or more verification languages;

3. Familiar with Python/Perl/Makefile and other programming tools and scripting languages;

4. Having good communication skills, coordination abilities, and a sense of teamwork;

5. Experience in vehicle specifications and SoC system chip verification is preferred.

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Qualification：Master's degree or above

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Complete detailed digital design based on chip system design specifications;

2. Responsible for RTL design and optimization of digital circuits, and completing the corresponding design document output;

3. Participate in FPGA verification work;

4. Develop module validation strategies together with validation and collaborate with the validation department to complete validation work;

5. Collaborate with the backend department to complete module timing optimization and area optimization.

1. Master's degree or above in microelectronics/EE/related majors, with at least 2 years of design experience;

2. Proficient in Verilog/System Verilog and able to independently complete digital circuit design;

3. Familiar with the digital front-end design process, including synthesis, formal verification, timing analysis, etc;

4. Familiarity with ARM SoC systems, AMBA bus protocols, and CAN/LIN/SENT/SPI interfaces is preferred;

5. Experience in vehicle design is preferred.

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Qualification：Master's degree or above

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Responsible for defining chip specification requirements, analyzing competitors, and gaining industry insights;

2. Responsible for chip architecture design and IP selection, and outputting overall solution documents;

3. Responsible for evaluating and making decisions on chip area, power consumption, performance, etc., and collaborating with design, backend, and other departments to optimize the chip's PPA;

4. Responsible for low-power design and optimization of chips;

5. Responsible for working with other departments to solve end-to-end technical challenges related to chips, including backend, packaging, chip testing, and system integration.

1. Master's degree or above in microelectronics/EE/related majors, with over 5 years of design experience;

2. Familiar with ARM SoC systems, AMBA bus protocols, and CAN/LIN/SENT/SPI/UART/I2C interfaces;

3. Familiar with the front-end and back-end processes of chips, including design, synthesis DFT、 Backend and other processes;

4. Having a deep understanding of chip PPA optimization, with priority given to having in-depth knowledge and development experience in low-power design and optimization;

5. Experience in vehicle design is preferred.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Collaborate with engineers in the fields of design, packaging, and manufacturing to complete chip signal integrity design;

2. Responsible for SIPI simulation and optimization of company chips/single boards;

3. Complete SIPI design and development from company chips to PCB module level, and provide competitive chip simulation solutions;

4. Responsible for locating and resolving signal integrity issues related to chips, modules, and solutions.

1. Bachelor's degree with at least 3 years of work experience in chip and PCB simulation, and at least 5 years are preferred;

2. Having expertise in electronic engineering, electromagnetic fields and microwaves, computer science, and other related fields;

3. Having good professional knowledge and background in transmission line theory, signal integrity, power integrity, RF, simulation, antenna, EMI/EMC, familiar with SIPI phenomena such as reflection, crosstalk, digital to analog interference, SSN, IR Drop and their solutions, possessing design capabilities and experience in power integrity and signal integrity;

4. Proficient in commonly used simulation software such as Ansys HFSS, Sivave, Keysight ADS, Cadence Sigrity, etc; Capable of SIPI modeling, full chain design, simulation, and testing;

5. Having an industry perspective and systematic thinking, with a strong interest in SIPI business;

6. Having self motivation, self-management awareness, and good teamwork spirit, daring to challenge, and striving for development.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Participate in the entire process of project development and mass production; Follow up on NPI trial production, summarize and analyze testing/process/design issues, conduct failure analysis, and provide improvement plans; Participate in mass production reviews, conduct overall evaluations of project maturity and transition to mass production status, ensure that product processes, quality standards, testing plans, etc. meet mass production requirements;

2. Yield analysis and data aggregation, driving preventive and corrective measures for fab/packaging/testing/design, etc;

3. Production management of chip products and effective control of fab/packaging and testing factory mass production.

1. Bachelor's degree or above in Electronic Engineering, Microelectronics, Materials Science, Chemistry, etc;

2. 3 years or more of Fab PIE or design house PE experience;

3. Familiar with the manufacturing/packaging process of semiconductor integrated circuits;

4. Strong communication and coordination skills, self-management awareness, good teamwork spirit, and willingness to challenge.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Familiar with advanced processes and chip design processes, able to develop reliability design requirements based on process characteristics and chip application conditions;

2. Responsible for arranging product reliability verification, including but not limited to HTOL, HAST, TC, ESD, Latch up and other related verifications;

3. Assist in analyzing chip failures during mass production/research and development processes internally, and track the resolution of reliability testing issues;

4. During the mass production stage, establish reliability sampling rules, track the sampling process and results, and conduct reliability assessments on abnormal batches, production, and customer returns of failed chips;

5. Participate in the development of unconventional reliability testing, explore new testing methods and test cases based on requirements.

1. Candidates with a major in electronics, microelectronics, or related fields, a bachelor's degree or above, at least 5 years of relevant work experience, and work experience in the semiconductor industry are preferred;

2. Familiar with semiconductor failure mechanisms and reliability testing standards (JEDEC, AEC-Q100, etc.), and familiar with reliability standards for automotive components is preferred;

3. Understand reliability engineering, be familiar with reliability testing, including but not limited to high acceleration/high stress testing, mechanical reliability, environmental reliability, life analysis, failure analysis, etc;

4. Have a certain level of English literature reading ability;

5. Has a strong sense of responsibility, good cooperation spirit, and team spirit.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Responsible for the ATE testing coverage, testability, manufacturability, and engineering experiments of the chip under test; Undertake and complete the development of ATE CHAR and HTOL engineering experimental programs, as well as anomaly localization analysis;
2. Responsible for testing mass production screening requirements, RMA problem handling, hardware environment setup, iterative vector verification and upgrade;
3. Responsible for the maintenance of chip testing equipment, analysis or design of abnormal location of testing supporting hardware tools;
4. Collaborative production testing import engineer, complete NPI mass production import, timely analyze mass production testing data and solve mass production testing problems;
5. In the mass production stage, continuously optimize ATE testing solutions, improve testing coverage and efficiency, reduce chip testing costs, and meet simple production maintenance and data analysis requirements.

1. Have solid knowledge in digital circuits, analog circuits, or RF communication;

2. Familiar with ATE testing process, FT/CP testing, and basic methods and theories of semiconductor testing; More than one year of relevant work experience in the semiconductor chip testing industry;

3. Familiar with the basic theory of designing testing hardware tools such as Loadboard and Probecard;

4. Familiar with mainstream ATE testing machines such as V93K, J750, UltraFlex, Dx, etc. is preferred;

5. Experience in developing or verifying chip ATE CP/FT testing programs is preferred;

6. Experience in layout is preferred;

7. Excellent professional ethics and sense of responsibility, good communication and coordination skills, good team spirit and cooperation spirit.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Responsible for developing the project quality assurance plan and implementing it according to the plan; Identify quality risks in project development, regularly report project quality status, promote quality problem resolution and risk prevention;

2. Responsible for providing process training, consulting, and guidance to the project team, and supervising project development to execute according to defined processes;

3. Responsible for quality management in the product development process, identifying areas for improvement, best practices, checklists, etc., and establishing or optimizing process specifications for each stage of the project;

4. Responsible for product development quality review and closed-loop to the design source, analyzing chip development process related data, organizing analysis and improvement of major quality issues, and promoting the improvement of delivery quality and efficiency;

5. Responsible for managing and maintaining the configuration library, and implementing project configuration management according to process requirements.

1. Full time undergraduate degree or above in communication, electronics, computer or related majors;

2. More than five years of QA experience in electronic product related R&D enterprises and experience in the chip design industry are preferred;

3. Familiar with electronic product development processes and product knowledge, with strong business understanding;

4. Master the knowledge of quality theory; Familiar with quality traceability and statistical engineering methods; Proficient in using the five major quality tools and seven major techniques;

5. Familiar with quality system requirements such as ISO9001 and IATF16949;

6. Work meticulously and rigorously, possess strong systematic thinking and planning skills, coordination and communication skills, and execution ability;

7. Experience in end-to-end quality management based on IPD product development is preferred;

8. Experience in developing automotive products is preferred.

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Qualification：Bachelor or above degree

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Product Strategy Planning and Execution

Develop an overall product strategy and product matrix for the company, and plan medium - and long-term product lines and corresponding products based on customer needs and market trends; Coordinate cross departmental teams to ensure consistency between product planning, product strategy, and company strategic goals;

2. Market Insights and Business Analysis

Deeply insight into market trends, competitive trends, and gain a deep understanding of customers' real needs, make business forecasts, identify product investment opportunities, and promote the implementation of product planning, providing decision-making basis and reference for product investment decisions;

3. Product definition implementation

Based on the development of the company's overall product strategy and product matrix, implement and promote the definition of products, including but not limited to key performance indicators such as benchmark products, product positioning, area power consumption, etc., and work with the R&D department to determine the launch rhythm of products;

4. Product Lifecycle Management

Sort out and optimize product processes, formulate strategies for product optimization, upgrading, and elimination, and maximize the value of various categories and specifications of products; Explore product models, explore product application scenarios and commercialization opportunities, promote product lifecycle management and value mining within the lifecycle;

5. Project Management

Responsible for overall planning and plan management related to product planning, controlling the progress of corresponding product planning, mobilizing corresponding resources to ensure the smooth implementation of product planning and management related work.

1. Bachelor's degree or above, major in integrated circuit related fields such as computer science, microelectronics, integrated circuits, semiconductor physics, etc., with over 8 years of work experience in product management or MCU related product research and development or product management consulting;

2. Having excellent market insight, strategic planning, data analysis skills, and execution ability, able to independently complete product portfolio planning and optimization work; Have certain data analysis skills, able to independently obtain and analyze data, drive product planning decisions and implementation;

3. Familiar with the chip industry, especially the automotive chip industry, with a deep understanding of industry dynamics and market trends, and able to master product management and related management methodologies, processes, and tools;

4. Having served as a product manager or product management manager in a large enterprise is preferred. Experience in complex product combinations and building product systems for large teams is preferred.

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Qualification：Bachelor or above degree

Work Address：China

Salary：

Update time：2025.03.28

1. Responsible for promoting, designing, importing, and maintaining automotive MCU chips and overall solutions in Tier 1 within the jurisdiction;

2. Understand customer needs and investment plans, guide customer needs, achieve sales targets, and maintain customer relationships;

3. Analyze market demand and competitor situation, develop response strategies, and assist the market in completing product planning;

4. Expand new customer resources, maintain existing customer relationships, and enhance customer satisfaction.

1. Bachelor's degree or above;

2. More than 3 years of experience in software and hardware development of automotive electronics related products or chips, with good technical accumulation;

3. Willing to communicate, skilled in communication, and continuously learning; Explore customer needs and develop corresponding strategies to meet them;

4. Having a pioneering spirit and the courage to break through and innovate;

5. Experience in developing or marketing automotive or industrial grade MCU technology is preferred; International Tier 1 vendor experience is preferred;

6. Outgoing personality, optimistic and positive, able to adapt to frequent business trips.

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Qualification：Bachelor or above degree

Work Address：Chongqing/Suzhou

Salary：

Update time：2025.03.28

1. Assist in sales and marketing to promote product marketing and facilitate project implementation;

2. Provide application solutions and technical support based on customer needs, and promptly address product technical issues reported by customers;

3. DEMO board production, demonstration plan development, technical document writing and organization, customer complaint handling;

4. Continuously conducting in-depth learning and research on product technology to enhance technical problem-solving capabilities for project completion;

5. Market technology research, exploring new applications and markets for products;

6. Provide product technical training to Sales, agents, and customers within the company;

7. Summarize typical problems and application cases, improve support platforms, and enhance support efficiency.

1. Bachelor's degree or above in electronics, communication, control related majors, with at least 6 years of work experience;

2. Experience in developing and debugging automotive MCU software (C, assembly);

3. Have at least one type of development experience: in vehicle Ethernet, multi-core, Autosar, and information security;

4. Having a solid understanding of circuit theory, digital and analog circuits, and proficient in using various debugging and testing tools;

5. Having independent thinking ability and the ability to quickly solve problems;

6. Excellent communication and expression skills, quick execution ability, outgoing personality, optimistic and positive, able to adapt to frequent business trips;

7. Familiar with MCU core architecture and related peripheral drivers, those with relevant work experience in automotive grade MCUs such as S32K, AURIX, or RH850 will be given priority consideration.

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