Qualification：Bachelor or above degree

Recruiting Numbers：unlimited

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Collaborate with engineers in the fields of design, packaging, and manufacturing to complete chip signal integrity design;
2. Responsible for SIPI simulation and optimization of company chips/single boards;
3. Complete SIPI design and development from company chips to PCB module level, and provide competitive chip simulation solutions;
4. Responsible for locating and resolving signal integrity issues related to chips, modules, and solutions.

1. Bachelor's degree with at least 3 years of work experience in chip and PCB simulation, and at least 5 years are preferred;
2. Having expertise in electronic engineering, electromagnetic fields and microwaves, computer science, and other related fields;
3. Having good professional knowledge and background in transmission line theory, signal integrity, power integrity, RF, simulation, antenna, EMI/EMC, familiar with SIPI phenomena such as reflection, crosstalk, digital to analog interference, SSN, IR Drop and their solutions, possessing design capabilities and experience in power integrity and signal integrity;
4. Proficient in commonly used simulation software such as Ansys HFSS, Sivave, Keysight ADS, Cadence Sigrity, etc; Capable of SIPI modeling, full chain design, simulation, and testing;
5. Having an industry perspective and systematic thinking, with a strong interest in SIPI business;
6. Having self motivation, self-management awareness, and good teamwork spirit, daring to challenge, and striving for development.

Qualification：Bachelor or above degree

Recruiting Numbers：unlimited

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Participate in the entire process of project development and mass production; Follow up on NPI trial production, summarize and analyze testing/process/design issues, conduct failure analysis, and provide improvement plans; Participate in mass production reviews, conduct overall evaluations of project maturity and transition to mass production status, ensure that product processes, quality standards, testing plans, etc. meet mass production requirements;
2. Yield analysis and data aggregation, driving preventive and corrective measures for fab/packaging/testing/design, etc;
3. Production management of chip products and effective control of fab/packaging and testing factory mass production.

1. Bachelor's degree or above in Electronic Engineering, Microelectronics, Materials Science, Chemistry, etc;
2. 3 years or more of Fab PIE or design house PE experience;
3. Familiar with the manufacturing/packaging process of semiconductor integrated circuits;
4. Strong communication and coordination skills, self-management awareness, good teamwork spirit, and willingness to challenge.

Qualification：Bachelor or above degree

Recruiting Numbers：unlimited

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Familiar with advanced processes and chip design processes, able to develop reliability design requirements based on process characteristics and chip application conditions;
2. Responsible for arranging product reliability verification, including but not limited to HTOL, HAST, TC, ESD, Latch up and other related verifications;
3. Assist in analyzing chip failures during mass production/research and development processes internally, and track the resolution of reliability testing issues;
4. During the mass production stage, establish reliability sampling rules, track the sampling process and results, and conduct reliability assessments on abnormal batches, production, and customer returns of failed chips;
5. Participate in the development of unconventional reliability testing, explore new testing methods and test cases based on requirements.

1. Candidates with a major in electronics, microelectronics, or related fields, a bachelor's degree or above, at least 5 years of relevant work experience, and work experience in the semiconductor industry are preferred;
2. Familiar with semiconductor failure mechanisms and reliability testing standards (JEDEC, AEC-Q100, etc.), and familiar with reliability standards for automotive components is preferred;
3. Understand reliability engineering, be familiar with reliability testing, including but not limited to high acceleration/high stress testing, mechanical reliability, environmental reliability, life analysis, failure analysis, etc;
4. Have a certain level of English literature reading ability;
5. Has a strong sense of responsibility, good cooperation spirit, and team spirit.

Qualification：Bachelor or above degree

Recruiting Numbers：unlimited

Work Address：Chongqing/chengdu

Salary：

Update time：2025.08.20

1. Responsible for the ATE testing coverage, testability, manufacturability, and engineering experiments of the chip under test; Undertake and complete the development of ATE CHAR and HTOL engineering experimental programs, as well as anomaly localization analysis;
2. Responsible for testing mass production screening requirements, RMA problem handling, hardware environment setup, iterative vector verification and upgrade;
3. Responsible for the maintenance of chip testing equipment, analysis or design of abnormal location of testing supporting hardware tools;
4. Collaborative production testing import engineer, complete NPI mass production import, timely analyze mass production testing data and solve mass production testing problems;
5. In the mass production stage, continuously optimize ATE testing solutions, improve testing coverage and efficiency, reduce chip testing costs, and meet simple production maintenance and data analysis requirements.

1. Have solid knowledge in digital circuits, analog circuits, or RF communication;
2. Familiar with ATE testing process, FT/CP testing, and basic methods and theories of semiconductor testing; More than one year of relevant work experience in the semiconductor chip testing industry;
3. Familiar with the basic theory of designing testing hardware tools such as Loadboard and Probecard;
4. Familiar with mainstream ATE testing machines such as V93K, J750, UltraFlex, Dx, etc. is preferred;
5. Experience in developing or verifying chip ATE CP/FT testing programs is preferred;
6. Experience in layout is preferred;
7. Excellent professional ethics and sense of responsibility, good communication and coordination skills, good team spirit and cooperation spirit.