On August 13, 2024, Chongqing Lanshan Automotive Electronics Co., Ltd. (hereinafter referred to as "Lanshan Electronics") held a strategic cooperation signing ceremony with Chongqing University of Posts and Telecommunications (hereinafter referred to as "Chongqing Post") and Chongqing Integrated Circuit Collaborative Innovation Center (hereinafter referred to as "Collaborative Innovation Center") at its headquarters in Chongqing. This signing marks a new stage in the tripartite cooperation.
At the signing ceremony, the three parties stated that they will establish a long-term, close, and pragmatic strategic partnership. In the future, they will take the development needs of "vehicle grade control chips, power management chips, analog circuit design, embedded software development" and other fields as the driving force, integrate the resources and technological advantages of the three parties, and cooperate to jointly build the "Chongqing Integrated Circuit Collaborative Innovation Center" and "Chongqing Integrated Circuit College". In addition, the three parties will strengthen cooperation in key core technology joint research and development, innovation platform co construction, talent joint training, high-level talent exchange, internship base construction, project application, reward application, achievement transformation and other aspects of industry university research application, work together to promote collaborative innovation and achievement transformation.
General Manager Li Tao, on behalf of Lanshan Electronics, thanks Chongqing University of Posts and Telecommunications and Chongqing Integrated Circuit Collaborative Innovation Center for their long-term support and trust in Lanshan Electronics. Li Tao stated that Chongqing University of Posts and Telecommunications and the Collaborative Innovation Center are the earliest and most profound universities and research institutions in Lanshan Electronics' scientific research cooperation. All three parties shoulder the historical mission of achieving independent control of key core technologies and mastering the initiative of independent innovation. This signing will play a positive role in deepening school enterprise cooperation and promoting the development of Chongqing's automotive integrated circuit industry.
Yang Hong, Secretary of the Party Committee of the School of Optoelectronics at Chongqing University of Posts and Telecommunications, stated that Chongqing University of Posts and Telecommunications is one of the postal and telecommunications universities established and key constructed by the state. It is a high-level teaching and research university jointly built by the Ministry of Industry and Information Technology and Chongqing Municipality, providing important support for national and local economic and social development and making unique contributions. This comprehensive cooperation in technology platform co construction, scientific research project cooperation, talent cultivation and exchange, and outstanding engineer projects is a powerful practice of school enterprise cooperation to create a joint innovation system, and a new exploration of industry education integration and science education integration. We look forward to the formation of more high-quality cooperation results.
Huang Yi, Deputy Director of the Industry University Research Office at Chongqing University of Posts and Telecommunications, stated that a new round of technological revolution and industrial transformation is restructuring the global innovation landscape. The tackling, breakthroughs, and innovation of key core technologies are more important and urgent than ever before. Faced with profound changes in the environment, it is imperative to upgrade the mode of industry university research cooperation.I hope to explore new models of school enterprise cooperation through this signing, with a more open attitude and flexible mechanism, to create a new highland for the automotive grade integrated circuit industry in Chongqing and even across the country, jointly promote the development of the domestic automotive grade integrated circuit industry, and become a backbone force for independent innovation and self-reliance in China's integrated circuit field.
In the future, the three parties will take this signing as an opportunity to actively seize the development opportunities of the integrated circuit industry, focus on advanced technology, upstream and downstream supply and demand information resources of the industry chain, build a comprehensive platform for industry chain docking and talent docking, strengthen collaborative innovation and exchange, further bring new ideas to the development of the integrated circuit industry, and promote the comprehensive strategic partnership of the three parties to a new level.
