Domestic 'chip' power shines at Munich Shanghai Electronics Show

The grand Munich Shanghai Electronics Show 2025 will be held from April 15th to 17th. Chongqing Lanshan Automotive Electronics Co., Ltd. (referred to as "Lanshan Electronics") made its debut with multiple high-performance and high reliability chip products and comprehensive automotive solutions, showcasing the hard core strength and innovative breakthroughs of domestic automotive grade chips to global customers, attracting widespread attention from industry experts and partners.

Two major types of chips are fully unveiled, providing comprehensive solutions for automobiles

Lanshan Electronics is a high-tech enterprise that focuses on providing customers with high-performance and high reliability automotive chips, accelerating the upgrading of safety, stability, electronicization, and intelligence in the automotive industry. At this exhibition, Lanshan showcased two major categories of self-developed full stack chips to the audience: MCU and power chip. The product adheres to the design concept of comprehensive, multi scenario, high security, and easy scalability. Centered around the new generation E/E architecture layout, Lanshan Electronics can provide efficient and intelligent solutions for automobiles from computation to execution.

From the anxiety of computing power in power domain control to the cost dilemma of vehicle electronics - the evolution of intelligent cars is calling for more precise chip level answers. Lanshan Electronics has released a full range of automotive MCU product combinations, covering the full range of intelligent vehicle scenarios with three "core" solutions: high-end domain control, mid-range performance, and low-end economy.

High end flagship: LS-N636- a new height for domestic domain control MCU

  • Technological breakthrough: Adopting the most advanced eFlash technology for automotive specifications, the performance improvement is significant and power consumption is reduced in the high-performance and high computing chip market

  • Security guarantee: ASIL-D functional safety level+3 core ARM Cortex R52 architecture (including 2 pairs of locking cores), meeting the needs of key areas such as powertrain/intelligent chassis

  • Innovation benchmark: Integrating four-way speed sensors to further reduce application costs

    The LS-N636, which made its debut this time, is one of the few automotive MCU chips in China that uses the most advanced eFlash technology, ultra-high performance, and ultra-high safety level. It meets the highest safety level ASIL-D specifications and covers application fields such as automotive power, intelligent chassis, functional safety controllers, domain controllers, etc. It can represent the advanced level of the industry and has attracted the attention of many customers and peers.

Mid end main force: LS-E14X series - balancing information security and cost-effectiveness

  • Computing power upgrade: ARM Cortex M4F@160MHz +2MB flash memory, supports seamless switching between A/B partitions

  • Security Innovation: Independent hardware encryption module, providing hardware level RSA/ECC encryption capability on the basis of Evita Media level implementation

  • Customer value: Can replace external SE chips and achieve a direct reduction in BOM costs for the solution

     Lanshan Electronics' chip series is one of the few domestically produced chips with ultra-high performance independent HSM modules. In addition to universal key management, symmetric encryption, secure boot, and other functions, it also has hardware asymmetric encryption functions (including ECC and RSA), which can cope with increasingly stringent road vehicle information security regulations. And in some scenarios, Lanshan Electronics' independent HSM module can save customers one SE (security engine) chip, achieving the goal of cost reduction at the solution level.

Low end boutique: LS-E10X series - an "excess configuration" for small figures

  • Flexible architecture: 24 independent PWM cores (industry average of 6)+hardware independent LIN modules, reducing load factor

  • Security bottom line: achieve ASIL-B functional security, Evita Light information security, support hardware secure boot, encryption and decryption services, and key management

  • Scene coverage: cost-effective options for vehicle electronic systems such as car windows, headlights, and air conditioning control

In the product design process, Lanshan Electronics has made flexible innovations in functional safety, information security, mathematical accelerator, PWM quantity, CAN/CAN-FD module, LIN module, etc., which can match more application scenarios. The LS-E10X is equipped with a 24 channel PWM module, and each channel can independently configure its frequency and duty cycle, greatly reducing the application limitations of the chip.Its mathematical accelerator compensates for the shortcomings of M0+kernel division and provides hardware acceleration for division, square root, and other functions. Unlike most domestic chips that use UART multiplexing, the LS-E10X series supports LIN dedicated modules that enable hardware implementation of baud rate synchronization, interval field detection and transmission, header transmission and response, reducing MCU load.

Lanshan's' core 'power makes its debut, driving the future with innovation

In terms of power chips, the intelligence of automobiles has raised higher demands for power chips. Lanshan Electronics is committed to providing smarter, more efficient, and more integrated power chips to meet the new needs of intelligent electric vehicles, and showcased multiple power products such as LDO, DC/DC, SBC, etc. at this exhibition.

This Munich Electronics Show is the first time that Lanshan Electronics has spoken out to the public since its establishment three years ago. Lanshan Electronics has brought multiple mass production cases, covering multiple fields such as Bluetooth keys, seat control, thermal management, motor drive, etc., fully demonstrating the company's innovative strength and multi-faceted applications in the automotive electronics industry chain.

At the exhibition site, many industry professionals visited the booth, observed the products and had in-depth exchanges, all of whom were impressed by the product development speed and product scale of Lanshan Electronics. Among them, the high-end MCU product LS-N636 further enriches the domestic high computing power electric drive control chips, which is also a modest contribution made by Lanshan to the industry. The recognition from the industry has once again strengthened Lanshan Electronics' determination and mission to become a leading domestic and world-class automotive semiconductor enterprise. Although the Munich Electronics Show has come to an end, Lanshan Electronics' innovative pace has never stopped. We will continue to deepen our knowledge in the field of intelligent automotive chips and work with partners to promote the innovation and globalization of domestic automotive chips.

headquarters address:4-5F, Building 10, Jintai Intelligent Industrial Park, Yubei District, Chongqing

Chengdu Branch:No. 1101, Building 2, Taihe International Financial Center, No. 619 Tianfu Third Street, Wuhou District, Chengdu City, Sichuan Province

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